Gaya APA
Teen-Hang Meen, Hsin-Hung Lin and Cheng-Fu Yang. (2024).
The 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023 .
Switzerland:
MDPI AG.
Gaya Chicago
Teen-Hang Meen, Hsin-Hung Lin and Cheng-Fu Yang.
The 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023.
Switzerland:
MDPI AG,
2024.
Electronic Resource.
Gaya MLA
Teen-Hang Meen, Hsin-Hung Lin and Cheng-Fu Yang.
The 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023.
Switzerland:
MDPI AG,
2024.
Electronic Resource.
Gaya Turabian
Teen-Hang Meen, Hsin-Hung Lin and Cheng-Fu Yang.
The 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023.
Switzerland:
MDPI AG,
2024.
Electronic Resource.